JPS6216466B2 - - Google Patents

Info

Publication number
JPS6216466B2
JPS6216466B2 JP54146566A JP14656679A JPS6216466B2 JP S6216466 B2 JPS6216466 B2 JP S6216466B2 JP 54146566 A JP54146566 A JP 54146566A JP 14656679 A JP14656679 A JP 14656679A JP S6216466 B2 JPS6216466 B2 JP S6216466B2
Authority
JP
Japan
Prior art keywords
package
chip
bubble memory
plasma ashing
organic matter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54146566A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5671872A (en
Inventor
Wataru Nozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14656679A priority Critical patent/JPS5671872A/ja
Publication of JPS5671872A publication Critical patent/JPS5671872A/ja
Publication of JPS6216466B2 publication Critical patent/JPS6216466B2/ja
Granted legal-status Critical Current

Links

JP14656679A 1979-11-14 1979-11-14 Bubble memory device and its manufacture Granted JPS5671872A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14656679A JPS5671872A (en) 1979-11-14 1979-11-14 Bubble memory device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14656679A JPS5671872A (en) 1979-11-14 1979-11-14 Bubble memory device and its manufacture

Publications (2)

Publication Number Publication Date
JPS5671872A JPS5671872A (en) 1981-06-15
JPS6216466B2 true JPS6216466B2 (en]) 1987-04-13

Family

ID=15410566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14656679A Granted JPS5671872A (en) 1979-11-14 1979-11-14 Bubble memory device and its manufacture

Country Status (1)

Country Link
JP (1) JPS5671872A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144854U (en]) * 1988-03-30 1989-10-04

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5231151B2 (en]) * 1973-07-13 1977-08-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144854U (en]) * 1988-03-30 1989-10-04

Also Published As

Publication number Publication date
JPS5671872A (en) 1981-06-15

Similar Documents

Publication Publication Date Title
US5888850A (en) Method for providing a protective coating and electronic package utilizing same
JP2688178B2 (ja) プラスチック包装モジュールからの半導体チップの回収方法
KR100572525B1 (ko) 플립 칩 반도체 장치를 제조하는 방법
KR920008249B1 (ko) 반도체장치의 제조방법
US5478779A (en) Electrically conductive projections and semiconductor processing method of forming same
US6230719B1 (en) Apparatus for removing contaminants on electronic devices
US4172907A (en) Method of protecting bumped semiconductor chips
US4181249A (en) Eutectic die attachment method for integrated circuits
JP2004282035A (ja) 半導体装置の製造方法
KR20050095199A (ko) 수축성 이형필름을 갖는 다이싱 필름 및 이를 이용한반도체 패키지 제조방법
JPS6216466B2 (en])
WO2002029133A1 (en) Remover and method for removing cured adhesives and coatings from substrates
US3515585A (en) Gelation coating method for electronic circuit panels
JP3112022B2 (ja) 半導体装置の製造方法
CN102779727A (zh) 解封集成电路封装体的方法
JPH01164041A (ja) バンプ構造を有するｉｃ素子とその製造方法
US3876461A (en) Semiconductor process
JP2662015B2 (ja) 半導体装置の製造方法
JP2000244076A (ja) 保護膜付きフレキシブルプリント回路用基板
JP2897438B2 (ja) ウエハープローバ
JPS59224136A (ja) 半導体装置の製造方法
JPH04214647A (ja) 半導体結晶物の取り付け方法
JPS6244851B2 (en])
JP2003094295A (ja) 半導体ウエーハ研削方法、半導体ウエーハおよび半導体ウエーハの表面保護材料
JPH0661286A (ja) 部分的樹脂開封方法